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《盖世汽车:2023中国车规级芯片产业白皮书(60页).pdf》由会员分享,可在线阅读,更多相关《盖世汽车:2023中国车规级芯片产业白皮书(60页).pdf(60页珍藏版)》请在本站上搜索。 1、2023Contents313.1 3.2 3.3 3.4 3.5 22.1 2.2 2.3 2.4 2.5 1.1 1.2 1.3 1.4 1.5 1.1 3-51.EDA2.IP1.2.3.4.5.6.7.8.9.10.11.12.13.14.15.16.17.18.19.20.1.2.3.4.5.6.7.8.910.1.2.3.4.5.6.7.8.9.10.1.2 9MCUDSPMPUCPUGPUNPUASICFPGASoCIGBTSiC/GaNMOSFETDRAMSRAMNOR FLASHNAND FLASHEEPROMLDODC/DCAC/DCPMICSBCCAN/CAN FDLIN2、ETHPHYWiFiNFCUWBT-BOXV2XeSIM/eSAM/LED/AILED1.3 40100300-8001.4:(/(/)403003,000605008,00010080014,000,26%,18%,14%,12%,9%,8%,6%,5%,1%,1%MCUCMOSe-flash65nm-28nm65nm50-100SOCCMOS16nm-7nm7nm5-101m60-90DC/DCBCD power0.13m-0.35m90-130BCD power0.13m50-70DDR3D NANDVLSI15-25nm20-30Flash3D NAND45-65nmMEMS0.1m-3、0.35m30-40CAN&LIN1m60-80CMOS28nm0.13m/28-55nmCMOS7nmIGBTSiC MOSFET0.18m20-40MOS-1,0001.4 SKSKARM2022,25%,20%,18%,15%,6%,16%IC1/21.5 IGBT202250025%2402022450203010%20%110202162021117740385202211NTT8Rapidus2027270020215K10SK1535102.9SK40%50%10%20%EDAEDAIP90%ARM92%ASML14nm90nmMCUSoCMCUSoC50%3nm/5nm14nm4、52%21%15%4%1.5 2023.032025302030702022.112021.112021.022020.11(20212035)2020.0725%2020.022018.072018-20201.5 发布地区发布时间政策名称重点内容北京2022.01北京经济技术开发区关于加快推进国际科技创新中心建设 打造高精尖产业主阵地的若干意见(简称“科创20条”)鼓励领军企业围绕车规级芯片、量子计算、细胞与基因治疗、元宇宙等前沿科技领域开展关键技术攻关,引导企业持续加大研发投入对承担“白菜心”工程的单位,给予研发投入最高50%的资金支持,支持金额最高为5,000万元天津2021.12天津5、市新一代信息技术产业发展“十四五”专项规划加快核心技术源头创新,聚焦高端芯片、关键器件、特色工艺、关键设备和原材料领域,推进国产CPU、射频芯片、通信芯片、汽车芯片、光通信芯片等一批核心技术突破,加快集成电路特色工艺研发和产业化,协同推进集成电路设备、核心零部件和硅片、第三代半导体等关键材料研发与产业化广东2022.06广州市智能网联与新能源汽车产业链高质量发展三年行动计划(2022-2024年)提升智能网联汽车关键核心零部件、核心技术供给水平,重点推动自主可控汽车芯片推广应用,形成较完备的汽车零部件产业供应体系,汽车零部件工业总产值达到1,800亿元江苏2022.01组织申报2022年度江苏6、省科技计划专项资金(重点研发计划产业前瞻与关键核心技术)项目聚焦第三代半导体、先进碳材料等重点优势领域,以及当前亟需攻关突破的工业软件、汽车芯片等关键实际问题,通过公开征集研发需求,组织专家凝练榜单,部署5项揭榜挂帅任务浙江2022.06关于省十三届人大六次会议嘉29号建议的答复A充分发挥我省在模拟芯片产业的优势,支持士兰微、斯达微等省内芯片龙头企业投资汽车芯片项目,指导省内已建、新建芯片生产线通过车规级验证,扩大车规级芯片生产能力,提高车规级芯片生产质量安徽2022.11贯彻落实实施方案落实高端通用基础零部件、重大装备配套专用基础零部件、汽车芯片等产品认证制度,提升认证一致性保障能力,促进基7、础零部件、元器件质量提升2022.07关于省政协十二届五次会议第0750号提案答复进一步组织关键核心技术攻关。全力支持长鑫、格易、全芯智造、杰发科技、聆思科技等开展存储芯片、EDA软件、汽车芯片、人工智能芯片攻关山东2022.03“十大创新”“十强产业”“十大扩需求”2022年行动计划补齐突破产业链薄弱环节,重点聚焦汽车芯片、液压件、机床功能部件、船用发动机等产业链关键环节开展协同创新、精准攻关,研制突破5种以上新技术和产品,推动产业基础高级化升级1.5 2022.0520222022.074541,000MCUMCU2021.082022.022021.0620212021.1133Cont8、ents313.1 3.2 3.3 3.4 3.5 22.1 2.2 2.3 2.4 2.5 1.1 1.2 1.3 1.4 1.5 2.1 预计2025年、2030年中国乘用车市场规模分别超过2,600万辆、3,000万辆20301,1003001,893 1,817 1,702 1,694 1,387 1,195 830 125 331 653 884 1,186 1,448 2,171 2020202120222023E2024E2025E2030E2,0182,1482,3552,5782,5733,0012,643118 142 167 180 290 456 504 559 7669、 1,150 2020202120222025E2030E300-5001,000L43,0002030450L3L4/L5630-1,0002025NEV54%1,4002030NEV72%2,10020255502.2 MCU232630333842466965768410010413720192020202120222023E2024E2025EMCU2020MCU6520251372021-202520.5%2022-2025MCU333842462021-2025CAGR11%MCU8MCU16MCU32MCUX-by-wire8MCU166%83217%77%MCUMCUMCUMC10、U30%70MCU300MCUMCU2.2 SOC56.788.1116.7141.6173.9203.955.4%32.5%21.3%22.8%17.2%0%10%20%30%40%50%60%0501001502002502020202120222023E2024E2025E400 735 973 1,209 1,435 1,646 51%55%62%68%74%78%0%10%20%30%40%50%60%70%80%90%02004006008001,0001,2001,4001,6001,8002020202120222023E2024E2025ESOC59%35%10%7%5%3%11、34%50%52%10%20%15%20222025E2030ENo ADAS/L0L1L2L3L4/L5961 1,073 1,227 1,380 20222023E2024E2025EL0L1L2L32019-20202020-20222022-202430-60k DMIPS60-120K DMIPS120-250k DMIPS+360WiFiDMS+VR/AR800HDRL1L2L3L4L5CPUKDMIPS102060200400TOPS2-44-840-150200-400AISoCSoCYole2.2 IGBTIGBT2026348011614218726430%31%158%412、5%22%32%41%0%20%40%60%80%100%120%140%160%180%050100150200250300201820192020202120222023E2024E2025EIGBTIGBTIGBT/(DC/AC)20%-30%/(DC/AC)IGBTIGBTSiCMOSFETsSiCGaNMOSFETSi MOSFET600900VSiCSiCSiCSi IGBT Si MOSFETSiC2.33.14.35.98.211.315.520192020202120222023E2024E2025ECAGR=38%IGBTSiCGaN2.2 12-131-45-8MMIC713、-13CIS,28%,72%2021MEMS29.5%28.4%7.6%35.5%23%12%28%5%4%185210242270305348202120222023E2024E2025E2026ECAGR=13.5%L2+/60%IC Insights2.2 DRAM(DDRLPDDR)NAND(e.MMCUFS)L1/L22030L4L5L4/L5ADASGBTBL5L120DRAM8NAND125TBDRAMNAND&4-64GB64-512GBADAS/6-64GB8-32GB0.5-2GB4-32GB4-16GB64-256GB0.5-1GB8-512GB1-4GB8-512GB-14、151GB-1856GBGB/SL125-50GB/s8GB DRAM8GB NANDL225-50GB/sTypical100GB/sMax8GB DRAM8GB NANDL3200GB/sTypical100GB/SMin8GB DRAM25GB NANDL4300-600GB/s16GB DRAM256GB NANDL5300-600GB/s16GB DRAM256GB NANDADAS3446525970822020202120222023E2024E2025ECAGR=19.3%GBTBMordor Intelligence2.2 PMICBMSAC/DCDC/DCLDOICAFEB15、MSSOCSOH800VAFEBMSAFE4.57.210.213.216.320222023E2024E2025E2026EAFE/ADAS17.518.218.119.220.321.44%-0.55%6.08%5.73%5.42%-1%0%1%2%3%4%5%6%7%051015202520202021E2022E2023E2024E2025EMouser2.2 V2VV2XCANLINFlexRayMOSTFPD Link 10100L4/L580-1201-24-54G/5GOTA1TBOXV2X1T-BOXWIFIGNSSUWBNFCCAN/LINFlexRayMOSTPHYSwi16、tch40-50SerDesUSBADASIVI2.5G/5G/10GE/E10%50%20202030E19.4305581137202120222023E2024E2025ECAGR=63.1%2.2 OTAUSBWIFINFCOTAT-BOXV2XESAMUWBNFC2,126 2,771 3,613 4,710 6,140 8,004 20212022 2023E 2024E 2025E 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PM2.5BMS2020MCU500MCUKF8A8KF32A32KungFu32T-BOX202265MCUWCU/ANP/TPSAC781xAC7801xAC7802xA20、C7840 xARM Cortex-MT-BOXIVI2021MCU1,0002018E3600/E3400/E3200ARM Cortex-R5FASIL DBMSADAS/202210E320090%OEMFlashM33Arm Cortex-M332022CS32F036QAEC-Q100 Grade 232ARM Cortex-M0 SAR ADCCS1795XCS1790XMCUCPUIPCCFC2002BC/CCFC2003PT/CCFC2006PTPowerPCC*Core CPUMCU CCFC2002BCCCFC2003PT CCFC2006PT BMSXL6600ARM C21、ortex-M3BLDC ASIL-B ASIL-C32 MCUMCUMCU+PowerASM87A/ASM87F/ASM31AARM Cortex-M0ASM31AK83X2022PTC资料来源:盖世汽车供应链数据库;盖世汽车研究院分析2.3 1-/FM33168xC25164KB FLASHOEM BAT32A237/239/279Cortex M0+T-BOX20226MCUFablessYTMYTM32B1HCortex-M78/16/32FC4150FC7300ARM Cortex M4M7BCMBCM+BMSHVACTPMST-BOXFC4150FC7300MCUSH4Cortex22、 M0+Cortex M3SH41232024LKS32AT085/LKS32AT0863Msps 12BITADCMCUAT085THD89MCU20212022MX10XMX20MX30HSMM01M02M03ARM Cortex-MBMSM01CVM014xCVM01xM02MCUMCUHCArm Cortex-MG32-2.3 2-SOC/SA81557nmCPU98KDMIPSGPUAdreno 640700MHz1126GFLOPSSA8295AI01Exynos Auto V9205K3DFHD4K240fps4K120fpsA395041.6GHz42KGPU 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XAI25Thor4nm2000TopsTransformer2025Snapdragon Ride5nmRideRide Flex2000Tops2024TITDA4 VM8TOPSR-Car V4H7nm34 TOPSADASAD2024MobileyeEyeQ Ultra20232025EyeQ5H7nmAI16TOPSCV72AQ8MP90720MP/sL2+AITransformer20232.3 2SOC/J516nmAI128TOPSL2-L52012050A1000NeurallQ 27、ISP161.2Gpps(CV)4K20222.5MDC610200TOPSL3-L4360NCAM5S HI7nm256TOPSRobotaxiV92023H30Int8256TOPS35WSoC7.3Tops/W2023R112nm16TOPSINT8AI30KDMIPSMIPI202220232Chiplet SoCChiplet Die-to-DieeHPC2025NPU/ISP/AIL2+165CMSDMS/OMSNOA2024SD5226400TOPSSoCL4AI202301AICPUC86012360ADASL32.3 3-IGBT IGBT8IGBT12,IDMIDBT81228、IGBT2022640IDMFab-Liter71200V IGBTFS77IGBT20258IGBTIDMIGBTt2021IGBTIGBT306 66SiC400 FablessTrench Field StopIGBTIGBT IDM6IGBT8IGBT2020IGBT19%IDM1200V 40AIGBTBGN40Q120SD2019 IGBT0.45%2018-2020 IGBT1.43%1.47%1.81%FablessMMIGBTIGBTIPM2022126IDMSGMIGBTIGBT 8 2022 43(385)IGBTSiC MOSIGBT IDM650VGBT(Trench29、 FS V)MOSFETIGBTIGBTIGBTIGBTFablesBLQG3040BLQG40T120IGBT2.3 3SiC MOSFETSiCIDM2016CoolSiCSiC MOSFET202225%-30%2022Q1202450200mm SiCIDM20214SiC MOSFET2024SiC202310LAPISSiCSTIDM2021SiC40%8SiCWolfspeedIDMSiC200SiC2021SiC14%2023Mohawk Valley8IDM650V SiC JBS 1200V SiC MOSFET IDMSiC MOSFETMD63HTO120P6HE12030、0V/6.3m55750V SiC1200V2in1 SiCA1320229SiC MOSFETIDM2023650V-1700VSiC MOSFET8SiC1700V/1000m SiC MOSFET1200V/75m SiC MOSFETOBC1200V/16mIDMSiCIDMSiCIDM2021GaNSiCIDM1SiC MOSFET1200-3300V2SiC MOSFET650-1200V/SiCFabless2021111,977,999,8005SiCSiC MOSFET 800V Fabless1200V SiC MOS1200V SiC MOSFET2.3 4-MPC-FC31、-400K-1.55AMEMS50MEMSMS1313NV402SXL3600,60%AR0143AT2024CMOS(CISCIS20%OX02A10ADASDMSCISIMX390CQV800CISSC120ASSC1330AT360CISCMOS360365nm+CISFPPI/800ADASCISFH83102.3 4-4DRXN774076GHz77GHzSiGe20200m77GHz1500BGT24AxxasMMIC24GHzMR200177 GHzS32R4516nm6412022TI(DSPIWRL643257GHz-64GHz7GHz202212STM41T56C6477G32、Hz77GHz20172010SG24T1/SG24R1SG24TR1224GHz2013SoC-ALPS201977 GHzADCbasebandCPU90RFIC2016RK1201L SRK1101ASRK1102A24Ghz2.3 4-VCSEL/SPADLumentumVCSELVCSELVCSELsAMSAMSAMS 12880VCSEL102402501260IBEOVCSELAMSOuster Tier1VCSELSPADASICSense Photonics VCSELTier1vCSEL+ICSPAD+SoCX01HiPhi ZL9VCSELAEC-Q102VCSELVCS33、EL850nm940 nm6VCSELIPOVCSELVCSELToFSPADSPADVCSEL2.3 5LPDDR4DDR3LPDDR2eMMC managed NANDSSDADAS2021LPDDR5ASIL D2021UFS 3.1DRAMNAND FlashCISeMMC 5.12021NAND2021.11ISO 26262:2018FSM2GB GDDR62GB DDR42021FlashDRAMFORESEE UFS 2.22022AEC-Q100 Grade 2FORESEE UFS 2.264GB-128GB2020 SRAMDRAM Flash ADASSRAMDRAM 34、2021DDR4LPDDR4,8Gb16Gb DDR4,8Gb LPDDR42022MCUNOR FlashGD25 NAND/Nor FlashEEPROMT-BOXADAS20212023NAND/Nor FlashDDR4LPDDR4DRAMSD/microSD cardseMMC EFDUFS EFDSDeMMC EFDIVIADASUFS EFDlVIADAS3D NAND e.MMCUFSISSIEEPROMNOR FlashNORFlashAEC-Q100Grade1NORFlashA1EEPROM2.3 6AutotalksV2X20239150C-V2XC-V2XCX186035、C-V2X30+30%BroadcomLSIBCM8958XBCM8955XBCM89586MMarvell28OEMPHYJL3xx12021ASAPHYYT80360ADASTBOXYT810AYT810ASTSN2022CANLINKD6630PHYTSNPHYKG7X2022Q4PHYCANLINCAN/LINGreen PHYG.Vn-LINCNG.vn CAN/LINICCAN/CAN FDCAN/LIN12023TSNTAS20102022EQM5100SerDesUSB2.3 7IC/ICLDODC/DCFabless2023LDOOBCDC-DCBMS2016OEM/Tier36、12022+DC/DC/T-BOX2023SA24403SA2134xSA22307SA22115SA32703CECDC/DCLDOCAN/RSDC/DCADAS202350-6020222023Q4BMSBMS AFEXL8806/XL8812BMS AFEDNB11682023FablessDC/DCDC/DCSC8101QAC/DCDC/DCLDOADAS20122022121DC/DCLDOM7DC/DCCANUSBICLED LDOLEDAW21036 AEC-Q100 DC/DCLDOADASAEC-Q100VDA6.32.3 8200TMS-T97TMS-T95TMD89T-B37、OXOBUESIMT-BOXV2X eUICCOBDTTM20TTM300TTM2000IVIT-BOXOBURSU8032CPU(SoC)CCM331OS-HCCM332OSCCM3310S-TOBUM2MXDSM3275XDSM3276XDSM3273XDSM1505T-BOXIVIOBURSU36MCUG9G9SEMCUCIU98T-BOXV2XETCNFC800FPGAFM1280OBUT-BOXOBUETCETC OBUTBoxFOTAUSBKEY KEY N32S032 N32A455T-BoxETC/OBUOBD N32A455MCU2.3 9/InfineonIC,MOSFET38、IGBT SiCIGBTILD6150LEDTI,TPS92075LEDLumissilIS32FL3749/LN33X61/LN40012SICLN40012iND832XXHSA6880-QIGBTSiCBF11811200V2022101200IC6AP0108T07-HP1B650V750VIGBTIGBTASICUL2.4 1/5NXPTI-MobileyeTINXPTITI-MobileyeTI-TINXPTITI-TICpressNECNXPNXPTI-Mobileye-TINECNXPTINXPTITIMobileyeMobileyeTIMicrochipNXPTITIMobi39、leyeTI-TIMicrochipNECNXPNXPTI-TI-TINECNXPNXPMobileye-TINXPNXP-Mobileye-Calsonic KanseiMicrochipNXPNXP-Mobileye-TIMicrochipNXPNXP-Mobileye-AMDAMDFSD-NXPTINXP-TINXPNXP-2.4 2/5OEMNXPTINXP990A990A610TIMicrochipNXPSTTIA7870A7870MobileyeTIJ3Orin-XTIMicrochipNXPNXPTI8155NXP i.MX88155MobileyeTIMobileye EyeQ40、4TI TDA4TIMicrochipNXPTINXPTI8155820AH3Mobileye610TIMicrochipNXPTINXPTI8155E02MobileyeTIMobileye EyeQ5HJ3+TI TDA4A1000-MicrochipNXPNXPTIM3Mobileye EyeQ4J2TIMicrochipNXPTINXPTIX98155H3X9TITI TDA4TIMicrochipNXPTIX9NXPTI81558666MobileyeTITDA4J3Orin-XDrive Xavier-MicrochipNXPTINXPTI8155H3MobileyeMobiley41、e EyeQ4TIMicrochipNXPTelechipsTINXP990AT78155820A990A+NXPMobileyeJ2610NXPTINXPTINXP8155H3MobileyeMobileye EyeQ4TI TDA4TI2.4 3/5820A81558155820ATI J6-J3*2J5Drive Orin-X*2NXP81558155Mobileye EyeQ4Drive Orin-XNXPT88155Orin-XDrive XavierTI81558156820A81558156820A8155820A-Mobileye EyeQ4Drive Orin-XOrin-X42、+TI TDA4TINXP8155TI8155TI01TINXPNXP8155Mobileye610J3TI TDA4TIJ3NXPNXPAC8025H3Mobileye-NXPNXPAC8025990A610TI2.4 4/5EDAMCU552.4 5/5Tier1Tier1Tier1MobileyeMobileyeTITIMobileyeTITIMobileyeTIMobileyeMobileyeTIACUTITITier1Tier1LGTITINXPNXPNXP2.5 1/2芯片设计晶圆制造封装测试EDASynopsysCadenceSiemens95%:MCULKAOntoArFiEU43、VPVD/CVD28nmALDEDA2.5 2/2ASIL B/C/DAEC-Q100 Grade2100TOPS1-100TOPS5%EDAIPASIL B/DAEC-Q100 Grade1/2/35%IPASIL B/DAEC-Q100 Grade0/190nmPMICAFEDC-DCBCDASIL B/DAEC-Q100 Grade0/1LEDASIL B/DAEC-Q100 Grade0/1/2/3SRAMDRAMNOR FLASH10%EEPROMNAND FLASHASIL B/DAEC-Q100 Grade0/1/24%ASIL BAEC-Q100 Grade 24G/5G3%C44、ANLINAEC-Q101AQG32490nm15%-20%ASIL BAEC-Q100 Grade1/25%5%15%Contents313.1 3.2 3.3 3.4 3.5 22.1 2.2 2.3 2.4 2.5 1.1 1.2 1.3 1.4 1.5 3.1 20212023IC40013SK2022IC568.0312.4%2022IC3005GARMIC-300IC3002022Q1()()()EDA50%2022529A0750EDA3.1 ICEDAIPEDAIP3.2 ICIC1354132050%5000CPU5,()30%,1000IP EDA,30%,500IC3.2 EDAIPSynopsysAMDADITICMP4613543.3 IC58766.4%2025 4 202525002022-202418003.3 3.4 20020211513.52022350EDA4541000MCUMCU3320213.4 3.5 SK2022IC329.5300202252022-20253.5 253514011057:15+/5G2.3.1.(12/)()(12/)()(12/)()(25/)()1.72.3.4.https:/